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Laird Technologies - Thermal Materials
Tflex™ 300 Series
Laird Technologies - Thermal Materials
Tflex™ 500 Series
 
Laird Technologies - Thermal Materials
Tflex™ 600 Series
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Tflex™ 500 Series

Thermal Gap Filler

Laird Technologies - Thermal Materials

Tflex™ 500 is a compliant elastomer gap filler designed to provide excellent thermal performance while remaining cost effective. This soft interface pad conforms well with minimal pressure, resulting in little or no stress on mating parts. Tflex™ 500’s unique silicone and filler combination has extremely low silicone extractable compared to many other silicone interface products. Tflex™ 500 meets NASA outgassing specification.

Features
  • Highly compliant and cost effective
  • Thermal conductivity 2.8 W/mK
  • Low thermal resistance even at low pressure
  • Naturally tacky for easy assembly
  • Low silicone extractable
Applications :
  • Cooling components to chassis
  • Telecommunication hardware
  • Thermal module for notebook computer
  • LED solid state lighting
Specifications
  • Adhesive:Tacky - Both Sides
  • Color:Blue
  • Material:Silicone Elastomer
  • Outline:228.60mm x 228.60mm
  • Shape:Square
  • Thermal Conductivity:2.8 W/m-K
  • Type:Gap Filler Pad, Sheet
Parts

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A14564-01A14564-01THERM PAD 228.6MMX228.6MM BLUE -Gap Filler Pad, SheetSquare228.60mm x 228.60mmRoHS
A14560-01A14560-01THERM PAD 228.6MMX228.6MM BLUE -Gap Filler Pad, SheetSquare228.60mm x 228.60mmRoHS
A14556-01A14556-01THERM PAD 228.6MMX228.6MM BLUE -Gap Filler Pad, SheetSquare228.60mm x 228.60mmRoHS
A14558-01A14558-01THERM PAD 228.6MMX228.6MM BLUE -Gap Filler Pad, SheetSquare228.60mm x 228.60mmRoHS
A14562-01A14562-01THERM PAD 228.6MMX228.6MM BLUE -Gap Filler Pad, SheetSquare228.60mm x 228.60mmRoHS
A14567-01A14567-01THERM PAD 228.6MMX228.6MM BLUE -Gap Filler Pad, SheetSquare228.60mm x 228.60mmRoHS

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