Results: 1 - 7 of 7
Supplier: Broadcom Limited
Subtitle: Single-Chip 802.11n Dual-Band 3x3 Wireless Solution
Description: Single-chip 802.11n dual-band 3x3 wireless solution enables Wi-Fi products to support 450 Mb/s data rates and achieves over 600Mb/s (TCP/IP) throughput in simultaneous AP/router configurations. By combining expansive wireless capacity with features to improve range, Broadcom's Intensify® chip ena...
Supplier: Samsung Semiconductor, Inc.
Subtitle: ARTIK™ 530/530S Modules
Description: The ARTIK™ 530/530s Module is a highly-integrated System-in-Module that combines a quad-core ARM® Cortex®-A9 processor packaged with 512MB or 1GB DRAM and Flash memory, a Security Subsystem, and a wide range of wireless communication option such as 802.11a/b/g/n for Wi-Fi®, Bluetooth® 4.2 (BLE+Cl...