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TO-2xx Series

Essentra Components TO-220-68

Supplier: Essentra Components

Subtitle: Transistor Insulator Pad
Description: This is a transistor insulator pad that provides electrical insulation. The length of this part is 1.13 in. It is made of gray silicone rubber and fiberglass composite.

Category: Thermal ProductsPads, Sheets

Tflex™ 300 Series

Laird Technologies - Thermal Materials A15973-10

Supplier: Laird Technologies - Thermal Materials

Subtitle: Thermal Gap Filler
Description: Tflex™ 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times.

Category: Thermal ProductsPads, Sheets

Tflex™ 500 Series

Laird Technologies - Thermal Materials Tflex™ 500 Series

Supplier: Laird Technologies - Thermal Materials

Subtitle: Thermal Gap Filler
Description: Tflex™ 500 is a compliant elastomer gap filler designed to provide excellent thermal performance while remaining cost effective. This soft interface pad conforms well with minimal pressure, resulting in little or no stress on mating parts. Tflex™ 500’s unique silicone and filler combination ha...

Category: Thermal ProductsPads, Sheets

Tflex™ 600 Series

Laird Technologies - Thermal Materials A14412-01

Supplier: Laird Technologies - Thermal Materials

Subtitle: Thermal Gap Filler
Description: Tflex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of proprietary boron nitride filler in the composition. While extremely soft, Tflex™ 600 recovers to over 90% of its original thic...

Category: Thermal ProductsPads, Sheets

Tflex™ 700 Series

Laird Technologies - Thermal Materials A15896-02

Supplier: Laird Technologies - Thermal Materials

Subtitle: Thermal Gap Filler
Description: Tflex™ 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts.

Category: Thermal ProductsPads, Sheets

Tflex™ HD300 Series

Laird Technologies - Thermal Materials Tflex™ HD300 Series

Supplier: Laird Technologies - Thermal Materials

Subtitle: Thermal Gap Filler
Description: Laird Tflex™ HD300 is a 2.7 W/mK gap filler material in Laird’s high deflection line of products. Tflex™ HD300 is an excellent choice when wide manufacturing tolerances occur as variable gaps can be filled with Tflex™ HD300 while generating minimal board and component stress. Tflex™ HD300 materia...

Category: Thermal ProductsPads, Sheets

Tflex™ HD400 Series

Laird Technologies - Thermal Materials Tflex™ HD400 Series

Supplier: Laird Technologies - Thermal Materials

Subtitle: Thermal Gap Filler
Description: Laird Tflex™ HD400 is a 4.0 W/mK gap filler material in Laird’s high deflection line of products. Tflex™ HD400 is an excellent choice when wide manufacturing tolerances occur. These variable gaps can be filled with Tflex™ HD400 while generating minimal board and component stress. Laird’s unique m...

Category: Thermal ProductsPads, Sheets

Tflex™ HD700 Series

Laird Technologies - Thermal Materials Tflex™ HD700 Series

Supplier: Laird Technologies - Thermal Materials

Subtitle: Thermal Gap Filler
Description: Laird Tflex™ HD700 is a 5.0 W/mK gap filler material in Laird’s high deflection line of products. Tflex™ HD700 combines 5 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal res...

Category: Thermal ProductsPads, Sheets

Tflex™ HD90000 Series

Laird Technologies - Thermal Materials Tflex™ HD90000 Series

Supplier: Laird Technologies - Thermal Materials

Subtitle: Thermal Gap Filler
Description: Laird’s Tflex™ HD90000 is the latest product in our High Deflection series. Tflex™ HD90000 combines 7.5 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a resu...

Category: Thermal ProductsPads, Sheets

Tflex™ HR400 Series

Laird Technologies - Thermal Materials A15959-36

Supplier: Laird Technologies - Thermal Materials

Subtitle: Thermal Gap Filler
Description: Tflex™ HR400 is a cost effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass production applications.

Category: Thermal ProductsPads, Sheets