Chip Quik Inc

TC3 Ultra Max™ Thermal Compound

Chip Quik's Ultra Max thermal compound is highly thermally conductive and electrically insulating

Image of Chip Quik's Ultra Max Thermal CompoundChip Quik's TC3 Ultra Max thermal compound series is available in three convenient sizes: 1 g/1 cc syringe, 3.5 g/3 cc syringe, and 10 g/3 cc syringe. The TC3 achieves thermal conductivity of 8.5 W/mK, allowing ICs to handle higher power loads while staying cooler with generated heat more efficiently transferred to the heat sink. The TC3 is electrically insulating, with an electrical volume resistivity of 4 x 1013 ohm-cm.

TC3 Ultra Max is heavily filled with heat conductive metal oxide creating a high-density thermal compound with 2.5 g/cc density. It is non-curing and non-flowing with low bleed and high-temperature stability. This thermal compound is lead-free, RoHS, and REACH compliant.

Ultra Max™ Thermal Compound

ImageManufacturer Part NumberDescriptionAvailable QuantityPriceView Details
HEAT SINK THERMAL COMPOUNDTC3-1GHEAT SINK THERMAL COMPOUND2024 - Immediate$5.10View Details
HEAT SINK THERMAL COMPOUNDTC3-3.5GHEAT SINK THERMAL COMPOUND80 - Immediate$12.82View Details
HEAT SINK THERMAL COMPOUNDTC3-10GHEAT SINK THERMAL COMPOUND323 - Immediate$32.55View Details
Published: 2021-08-02