Product Highlights > Stac64™ Single, Multi-Pocket and Hybrid Header System

To address the growing electronic device requirements within today's vehicles, Molex has developed a modular 0.64, 1.50, and 2.80 mm terminal-header system. The Stac64 connection system allows OEM and device manufacturers greater design flexibility to support both low-level signal requirements, as well as power applications up to 30.0 A. The Stac64 system allows automotive manufacturers to use header assemblies as stand-alone components, as well as gang multiple headers together to support a large range of signal and power needs for devices and modules.

The standard product line based on the 0.64 mm pitch terminal includes 8-, 12-, 16-, and 20-circuit connectors in both vertical and right-angle headers, supporting low-level signal requirements. In addition, 10- and 14-circuit power-pocket versions, supporting power applications for 1.50 and 2.80 mm pitch terminal systems, are available in vertical and right-angle configurations. This Stac64 is a standard product system based on USCAR-2 Class II mechanical- and electrical-performance characteristics for unsealed connector applications. The connectors mate to existing wire-harness connectors designed to the USCAR/EWCAP industry footprints.

The Stac64 standard-product offering is tooled at high-cavitation and is fully validated at the single-pocket level. This greatly reduces time-to-market by eliminating the need for additional tooling. Bio-plastic Stac64-e, the automotive industry’s first renewable, plant-based resin connector, provides an alternative to traditional petroleum-based connectors while offering equivalent performance and quality characteristics of the proven Stac64 connection system. Bio-plastic resin connectors address increasing demands for environmentally-preferable solutions for automotive applications. The Stac64-e connection system has received UL Environment ECV certification for containing 71% bio-based organic-carbon content.

Features
Stackable connection system of readily available PCB headers Reduced time-to-market with engineering and validation times reduced significantly The header and receptacle housings are molded in standard USCAR color schemes for additional polarizations No tooling necessary to produce custom multi-bay headers Pre-assembled, linear Mylar PC tail-alignment strip for right-angle headers Matches harness connector color-coding scheme for visual aid in assembly Modular-housing design with standard dovetail features molded into the housings Applied assembly labor and cost savings		PCB alignment posts Allows headers to be ganged together in large assemblies to meet growing terminal quantity requirements PCB standoffs molded into housings Ensure all terminals are properly aligned into PCB board through-holes during assembly Retain header to PCB during assembly and solder processing High-temperature thermoplastic housing Withstand infra-red (IR) and wave lead-free solder processing per SMES-152 Molex specification Pre-assembled TPA-to-receptacle housing shipped as single assembly Reduces PCB packaging complexity and provides space savings

Applications

Automotive Door-Zone Modules Interior Lighting and Navigation Navigation Systems Power Seat Modules Radios/DVD - Entertainment Commercial Vehicle Interior Electronic Modules