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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
374324B00035G | |
|---|---|
DigiKey Part Number | HS318-ND |
Manufacturer | |
Manufacturer Product Number | 374324B00035G |
Description | HEATSINK BGA W/ADHESIVE TAPE |
Manufacturer Standard Lead Time | 14 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level |
Datasheet | Datasheet |
Product Attributes
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Category | Length 1.063" (27.00mm) |
Mfr | Width 1.063" (27.00mm) |
Series | Fin Height 0.394" (10.00mm) |
Packaging Box | Power Dissipation @ Temperature Rise 3.0W @ 90°C |
Part Status Active | Thermal Resistance @ Forced Air Flow 9.30°C/W @ 200 LFM |
Type Board Level | Thermal Resistance @ Natural 30.60°C/W |
Package Cooled | Material |
Attachment Method Thermal Tape, Adhesive (Included) | Material Finish Black Anodized |
Shape Square, Pin Fins | Base Product Number |
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In-Stock: 2 453
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Quantity
All prices are in EUR
Box
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | 2,27000 € | 2,27 € |
| 10 | 2,00700 € | 20,07 € |
| 25 | 1,91200 € | 47,80 € |
| 50 | 1,84300 € | 92,15 € |
| 100 | 1,77640 € | 177,64 € |
| 250 | 1,69192 € | 422,98 € |
| 756 | 1,59521 € | 1 205,98 € |
| 1 512 | 1,53738 € | 2 324,52 € |
| 5 292 | 1,43797 € | 7 609,74 € |
| Unit Price without VAT: | 2,27000 € |
|---|---|
| Unit Price with VAT: | 2,81480 € |
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